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Sehokelo sa ho Snap-On sa Magnetic
90°Moralo oa ho tjheseletsa o nang le lehlakore le chitja o boloka sebaka sa ho kenya 'me o loketse lisebelisoa tse tšesaane le lisebelisoa tse nyane tsa liteko
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Sehokelo sa makenete
Lihokelo tsa Pogo Pin tse ikhethileng, lihokelo tsa makenete, likhoele tsa ho tjhaja makenete, le likopano tsa lihokelo tse nepahetseng
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Sehokelo sa Pogo Pin se kentsoeng ka lehlakoreng, sehokelo sa phini ea selemo sa mofuta oa patch
Sebopeho sa moralo: sebopeho se sekametseng Mokhoa oa ho kenya: SMT surface mount (SMD) reflow soldering Khanyetso ea ho ikopanya: <30 milliohms Lebelo la hona joale: 2A~30A (lebelo la hona joale le tsoelang pele) Motlakase o lekantsoe: 36V AC/DC Ho tšoarella: 10000~100000 lipotoloho Mocheso o sebetsang: -40 ° C~+120 ° C Khanyetso ea spray ea letsoai:>Teko ea ho bola ea lihora tse 96 E lumellana le maemo a EU RoHS le Reach Lihlahisoa tse ngata tse tloaelehileng tseo u ka khethang ho tsona, tse fanang ka litšebeletso tse ikhethileng -
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SCFB038
Letoto la SCFB038
Liparamitha tsa Lihlahisoa
Lisebelisoa le ho penta:
Tube ea Nalete (Barrel): Ph, Au on Ni e koahetsoeng
Nalete 1 (Plunger): SK4/Becu, Auon Ni Plated; PD, Ha e na PlatedNalete 2 (Plunger): SK4/Becu, Au on Ni Plated; PD, Ha e na PlatedSelemo (Selemo): SWP /SUS, Au on Ni Plated
Litlhaloso tsa Motlakase:
Hona Joale e sa Fetoheng ka Pele (Tekanyetso ea Hona Joale): 3 Amps
Bophara ba mothapo: -1 dB @ 13.1 GHz Bophara ba mothapo (Bophara ba mothapo):1.20 nHC Bophara ba mothapo:1.55 pF
Selelekela sa Sehlahisoa
nig est ctort ehen n ltucuranl ae d. auarea mingl ao rbe cnel uon ad doube ation pro esth eml volume le
E sebelisoa haholo bakeng sa khanyetso e tlase haholo ea ho kopana le bandwidth e phahameng haholo likarolong tse fapaneng tsa motlakase oa puisano, semiconductor waferliteko, tlhahlobo ea liphutheloana tsa chip, jj., ho fihlela litlhoko tsa tlhahlobo ea lets'oao la maqhubu a phahameng a 5-40G.
Hona jwale, Xindeli e ka sebetsana le bophara ba probe e nyane: hlooho p: 0.06 mm / nale tube q: 0.10 mm.
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PT018
Letoto la PTo18
Liparamitha tsa Lihlahisoa
Lisebelisoa le ho penta:
Hlooho ea Nalete (Plunger): Becu/SK4, Au on Ni PlatedTube ea Nalete (Barrel): Ph / Br, Au on Ni PlatedSelemo (Selemo): SWP / SUS, Au on Ni PlatedSleeve ea Nalete (Casing): Ph / Br, Au on Ni Plated
Litlhaloso tsa Motlakase:
Sekontiri (Sekontiri): 0.46 mm (18 mil)
Hona Joale e Tiileng ka Pele (E Lekantsoeng Hona Joale): 0.3 Amps, e Tsoelang Pele
Khanyetso e Lekantsoeng (Khanyetso e Lekantsoeng): 250 mO
Boholo ba Lesoba la ho Kenya: 0.40 mm
Tekanyo ea Stroke: 1.0 mm Elasticity e Lekantsoeng (Matla a Lekantsoeng): 20 gf (0.7 oz)
Sehlahisoa se selelekela
Li-PCB spring pin li sebelisoa haholo-holo bakeng sa ho leka liboto tsa PCB ka ho bapisa khanyetso kapa capacitance pakeng tsa mela le mela ho bona liphoso tse kang ho tsoela pele ha mola. Ka tloaelo. Li-PCB spring pin li sebelisoa ka matsoho a nale, matsoho a nale a ka aroloa ka a nang le mehatla e hokahaneng le lithapo le a se nang lithapo. -
SCPA035
SCPA035Letoto
Liparamitha tsa Lihlahisoa
Lisebelisoa le ho penta:
Tube ea Nalete (Barrel): Ph/SP, Au on Ni e koahetsoeng
Nalete 1 (Plunger): SK4 / Becu, Auon Ni Plated; PD, Ha e na PlatedNalete 2 (Plunger): SK4/ Becu, Au on Ni Plated; PD, Ha e na PlatedSelemo (Selemo): SWP /SUS, Au on Ni Plated
Litlhaloso tsa Motlakase:
Hona Joale e sa Fetoheng ka Pele (Tekanyetso ea Hona Joale): 3 Amps
Bophara ba mothapo: -1 dB @ 14.8 GHz
Inductace (Inductace): 1.25 nH
Bokgoni (Captance):1.63 pF
SehlahisoaSelelekelaLi-probe tsa teko ea semiconductor li boetse li tsejoa e le li-probe tsa lihlooho tse peli. Mefuta ea nale ea kahare e sebelisoang hangata e kenyelletsa B, JJ, U, U1,et, ka litlhoko tse nyane tsa bophahamo le tsa ho nepahala ho phahameng. E arotsoe ka sebopeho ka: letoto la li-probe tsa lihlooho tse peli - tse peli, letoto la li-probe tsa lihlooho tse peli.
E sebelisoa haholo bakeng sa khanyetso e tlase haholo ea ho kopana le bandwidth e phahameng haholo likarolong tse fapaneng tsa elektroniki tsa matla a puisano, tlhahlobo ea semiconductor wafer, tlhahlobo ea ho paka ea chip, jj, ho fihlela litlhoko tsa tlhahlobo ea lets'oao la maqhubu a phahameng a 5-40G.
Hona jwale, Xindeli e ka sebetsana le bophara ba probe e nyane: hlooho: 0.06mm / tube ya nale q: 0.10mm. -
SWP165
Letoto la SWP165
Liparamitha tsa Lihlahisoa
Lisebelisoa le ho penta:
Nalete 1 (Plunger): BeCu, Au on Ni PlatedTube ea nale (Barrel): Koporo, Au on Ni PlatedNalete 2 (Plunger): BeCu, Au on Ni Plated
Karolo: PTFE
Selemo (Selemo): SWP, Au on Ni Plated
Litlhaloso tsa Motlakase (Litlhaloso tsa Motlakase):
Hona Joale e sa Fetoheng ka Pele (Sekhahla sa Hona Joale): 17A (30s)/10A (300s)
Khanyetso ea ho ikopanya: 160 mil ohms
Litlhaloso tsa Tekheniki:
Stroke e Felletseng: 5.0 mm
Tekanyo ea Stroke: 3.3 mm
Matla a Selemo a Lekantsoeng (Matla a Selemo): 100 gf @ mojaro 3.3 mm
Boemo ba Tloaelo: Pin 1,2 E Butsoe
Tobetsa Tlase: Pin Rod 1,2 Conductive (Tobetsa Tlase 1.5mm)
Sehlahisoa
selelekela se etsa masimo a othomathiki. maemo a prout le a requremens a eced tsohle tsa oter bona lipini tsa teko. lipini tsa hae tse nang le lipini tsa lihamore tse se nang khoele tse nang le pin, lipini tsa switch tsa harness, harness – lipini tsa motlakase o phahameng, jj. -
Letoto la 6.60×2.0×0.06
Letoto la 6.60×2.0×0.06
Liparamitha tsa Lihlahisoa
Lisebelisoa le ho penta:
Thepa (Thepa): Ni Alloy
Lera la ho roala (Le koahetsoeng): Au ho Ni le koahetsoeng
Litlhaloso tsa Motlakase:
Hona Joale e sa Fetoheng ka Pele (Tekanyetso ea Hona Joale): 1.5 Amps
Khanyetso ea ho ikopanya: 100 mO
Litlhaloso tsa Tekheniki:
Botenya (Botenya): 0.06 mm
Stroke e Felletseng: 0.60 mmStroke e Lekantsoeng: 0.20 mmMatla a Lekantsoeng: 50/65 gfPotoloho ea Bophelo: Lipotoloho tse 400,000
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Letoto la PCM350-461
Letoto la PCM350-461
Liparamitha tsa Lihlahisoa
Lisebelisoa le ho penta:
头(Plunger): BeCu/SK4, Au PlatedTube ea nale (barrel): Koporo, Au Plated
Selemo (Selemo): SUS, Ha ho na Plate
Sleeve ea Nalete (Seaparo): Koporo, Au e Tloaelitsoeng
Litlhaloso tsa Motlakase:
Tekanyo ea Hona Joale:<50A (mochesong oa kamore)
Khanyetso ea ho Kopana (Khanyetso ea ho Kopana): < 10mO
Litlhaloso tsa Tekheniki:
Libaka: 5.08 mm (200mil)
Stroke e Felletseng: 8.50mm
Lekantsoe Stroke (Lekantsoe Stroke):7.40mm
Matla a Selemo a Lekantsoeng: 10.6oz-3000gf/17.6oz-500gf/35.3oz-1000gf
Mocheso / Sebaka sa ho kenya:
温度(Mocheso): -100°~ +200°C
E sebelisoa bakeng sa RCM350-461-SC_A epoxy glass cloth low base plate le thepa ea epoxy resin: 3.99mm
Bakeng sa maqephe a pampiri a entsoeng ka lesela la khalase la RCM350-461-SC/RCM350-461-M a nang le epoxy le thepa ea resin ea epoxy: 4.00-4.02 mm -
SCPA016
Ni e koahetsoeng
Nalete 1 (Plunger): SK4 / Becu, Auon Ni Plated; PD, Ha e na PlatedNalete 2 (Plunger): SK4 / Becu, Auon Ni Plated; PD, Ha e na PlatedSelemo (Selemo): SWP / SUS, Au on Ni Plated
Litlhaloso tsa Motlakase:
Hona Joale e sa Fetoheng ka Pele (Tekanyetso ea Hona Joale): 4 Amps
Bophara ba mothapo: -1 dB @ 7.5 GHz
Inductace (Inductace): 1.45 nH
Bokgoni (Captance):1.95 pF
Selelekela sa Sehlahisoa
olume le acura e haufi haholo e hloka. structural ided inte: dua head – singe -acion probe, dual head – double-action probe seles.
E sebelisoa haholo bakeng sa khanyetso e tlase haholo ea ho kopana le bandwidth e phahameng haholo likarolong tse fapaneng tsa elektroniki tsa matla a puisano, tlhahlobo ea semiconductorwafer, tlhahlobo ea ho paka ea chip, jj, ho fihlela litlhoko tsa tlhahlobo ea lets'oao la maqhubu a phahameng ho 5-40G.
Hona jwale, Xindeli e ka sebetsana le bophara ba probe e nyane: hlooho: 0.06mm / tube ya nale p: 0.10mm.
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SCPA035
Letoto la SCPA035
Liparamitha tsa Lihlahisoa
Lisebelisoa le ho penta:
Tube ea Nalete (Barrel): Ph / SP, Au on Ni e koahetsoeng
Nalete 1 (Plunger): SK4/Becu, Au on Ni Plated; PD, Ha e na PlatedNalete 2 (Plunger): SK4 / Becu, Au on Ni Plated; PD, Ha e na PlatedSelemo (Selemo): SWP /SUS, Au on Ni Plated
Litlhaloso tsa Motlakase:
Hona Joale e sa Fetoheng ka Pele (Tekanyetso ea Hona Joale): 3 Amps
Bophara ba mothapo: -1 dB @ 14.8 GHz
Inductace (Inductace): 1.25 nH
Bokgoni (Captance):1.63 pF
Selelekela sa Sehlahisoa
Li-probe tsa teko ea semiconductor li boetse li tsejoa e le li-probe tsa hlooho e habeli” Mefuta ea nale ea kahare e sebelisoang hangata e kang B, JJ1,, U1, jj., ka bophahamo bo bonyenyane le litlhoko tse phahameng tsa ho nepahala. E arotsoe ka sebopeho ka: letoto la li-probe tsa hlooho e le 'ngoe tse peli, letoto la li-probe tsa hlooho e peli tse peli.
E sebelisoa haholo bakeng sa khanyetso e tlase haholo ea ho kopana le bandwidth e phahameng haholo likarolong tse fapaneng tsa motlakase oa puisano, tlhahlobo ea semiconductor wafer, tlhahlobo ea liphutheloana tsa chip, jj., ho fihlela litlhoko tsa tlhahlobo ea lets'oao la maqhubu a phahameng a 5-40G.
Hona jwale, Xindeli e ka sebetsana le bophara ba probe bo bonyenyane: hlooho p: 0.06mm/nalete ya nale p: 0.10mm.
