September 4, 2026
1、 Technological leap: Spring ejector pin CNC machining moves from consumer electronics to AI computing infrastructure
（1） From Smartphones to AI Servers: The “Computing Power Upgrade” of Spring Top Needles
Pogo Pin is a high-precision spring type conductive connector, which is assembled by precision riveting of three core components: needle, spring, and needle tube. In the field of consumer electronics, it has long served scenarios such as mobile phone charging touchpoints and smart wearables; In the era of AI computing power, this precision component is undergoing a profound transition from the “consumer level” to the “computing power level” – AI servers GPU Socket、 High density interconnection scenarios such as high-speed backboards are becoming a new battlefield for spring top pin technology.
With the exponential growth in demand for AI computing power, new generation AI server architectures such as NVIDIA GB200 and Rubin Ultra are forcing a switch in connectivity solutions – from traditional stamping springs to Micro Pogo Pins, with tens of thousands of pin level connections in a single cabinet. Micro Pogo is a miniaturized upgraded product of traditional Pogo Pin, designed for ultra miniaturization, high density, and ultra-thin space. The industry standard for needle body outer diameter is now less than 0.8 millimeters. Structurally, Micro Pogo consists of a needle tube, a micro spring, and a needle tip, which are assembled at the micrometer level through precision pressing and closing processes.
（2） When Stamping Bullets Reach Physical Limits: Micro Pogo’s Technological Breakthrough
Stamping springs and spring pins are two mainstream elastic contact schemes in high-density board to board interconnection. The advantage of stamping shrapnel lies in its low cost and suitability for large-scale production, but it is facing triple bottlenecks in AI server scenarios.
In terms of high-frequency signal integrity, the cantilever beam bending structure has excess conductive extension segments (residual piles/Stubs), which can cause serious signal reflection and insertion loss deterioration in the frequency band of 56GHz and above. In terms of spacing and density, the bending of cantilever beams requires reserved lateral deformation space, with a minimum pitch generally ≥ 1.0mm. When a single chip requires thousands of pins, the connector area may exceed the chip itself. In terms of compression stroke, the thermal warpage deformation of high-power chips often requires a compensation stroke of ≥ 0.5mm, while the effective stroke of stamped spring after compression is severely limited.
The combination of these three restrictions means that in scenarios where high frequency (≥ 56GHz), high density (Pitch<1.0mm), and large stroke (≥ 0.5mm) occur simultaneously, stamping shrapnel is no longer the optimal solution. And this is precisely the standard requirement for AI server XPU Socket, high-speed backplane and other scenarios. The core structural advantage of Micro Pogo lies in its native cylindrical independent contact+residue free design – each pin is an independent and regular cylindrical conductor, without any excess conductive extension that can cause high-frequency reflection. The mass-produced product has achieved a transmission rate of 224Gbps PAM4 with an ultra small spacing of 0.35mm.
（3） CNC precision machining: manufacturing bases with micrometer level precision
The manufacturing of Micro Pogo and high-end spring top pins places extreme demands on CNC precision machining technology. Every process from needle tubes, micro springs to needles relies on high-precision CNC machines, precision automatic lathes, and other equipment. Domestic leading enterprises have mass-produced extremely fine probes with a diameter range of Φ 0.12 to 0.16 millimeters and an ultra precision tolerance of ± 0.003 millimeters.
In the field of high-speed interconnection of AI servers, enterprises such as TopLink have built a professional technical matrix covering Micro Pogo Pin, AI server high-speed interconnection technology, and testing probes, benchmarking the international top level in key technologies such as ultra high speed signal integrity, high reliability connection, and micro nano manufacturing. Dianlian Technology (300679) also clearly stated that the company continues to pay attention to the technological evolution and market opportunities of Pogo Pin in the field of AI servers. With precision manufacturing processes, high-frequency and high-speed transmission technology accumulation, and large-scale production capabilities, the company actively lays out related product research and development and market expansion.
2、 Industrial opportunity: “connector dividend” of 200 billion AI infrastructure with ByteDance
（1） 200 billion capital expenditure: the ‘Chinese variable’ in the AI computing power arms race
In 2026, ByteDance’s investment in AI infrastructure shocked the industry. The company has raised its AI infrastructure capital expenditure plan for 2026 to over 200 billion yuan, a significant increase from the initial plan of about 160 billion yuan at the end of 2025. This figure is equivalent to about 60% of the company’s profit in 2025. Combined with its overseas expansion of data centers worth 25 billion US dollars in Thailand and 1 billion euros in Finland, ByteDance is becoming a key variable in the global AI computing power arms race.
From the perspective of funding allocation, approximately 115 billion yuan will be used for the construction of physical infrastructure such as data centers and intelligent computing centers; The special budget for AI chips and supporting infrastructure has reached 85 billion yuan. On the server side, Inspur Information holds over 70% of ByteDance’s supply share, with orders scheduled until 2027. ByteDance is also expanding large-scale AI intelligent computing centers in Anhui, Inner Mongolia, Yunnan and other places, adding more than 100000 server cabinets, all of which use liquid cooling for heat dissipation.
（2） From Taihang Computing Power Center to Hypernode Cluster: The “Full Link” Requirement for Connectors
The computing infrastructure layout of ByteDance is comprehensively pulling the market demand for spring thimbles and precision connectors from three levels: server internal interconnection, board to board connection, and system level high-speed backplane.
At the level of computing center construction, ByteDance’s Volcano Cloud Taihang Computing Center Phase II Project has a total investment of 4.5 billion yuan, with 15604 12kW server cabinets and 510 network cabinets planned. The bidding for ByteDance in 2026 clearly requires that 95% of the cabinet power should not be less than 21kW, and if it exceeds 21kW, it must be liquid cooled. High power density computing power clusters pose higher requirements for the heat dissipation performance and signal integrity of high-speed interconnect solutions.
At the level of supernode clusters, ByteDance’s supernodes are expected to experience a massive increase in volume from the second half of 2026 to 2027. Domestic supernodes are likely to be mainly connected with 224G high-speed copper in the cabinet, and can evolve to 448G or even higher in the future. The connector and cable value of the 128 card matching Alibaba Panjiu server is about 700000 yuan, and the Byte solution is expected to be similar to this. The high-speed line module segment has been recognized by institutions as a core track with high barriers, high value, and high profit margins.
At the supply chain supporting level, Huafeng Technology’s high-speed backplane connector and high-speed line module products have promoted or carried out project cooperation with Alibaba, Tencent, Byte and other Internet application customers. As a core hardware supplier for high-speed interconnection in Byte data centers, Jinxinnuo deeply binds PCIe high-speed connection requirements, with products covering server high-speed cables (PCIe 5.0/6.0800G/1.6T), board end connectors (PCIe Gold Finger/high-speed backplane), and more. Enterprises such as Changying Precision and Bull Group have also established cooperative relationships with ByteDance. ByteDance is still recruiting connector/Cable engineers to be responsible for the full life cycle R&D and design of customized connectors (high-speed/power connectors, etc.).
（3） Market size: Billion connector increment under billion dollar infrastructure
From the global Pogo Pin connector market perspective, the market size is expected to be around 422 million to 463 million US dollars by 2025. But in the AI server segment, the growth slope is much higher than the industry average. Micro Pogo, as the core contact component for high-speed interconnection of AI servers and semiconductor testing, is entering an explosive period with the wave of AI computing power investment.
Take ByteDance as an example, its investment in AI infrastructure alone reached 200 billion yuan. Based on the estimated value of connectors and cables in server hardware, the value of connectors and cables for a single 128 card server in Byte Solution is approximately 700000 yuan. As the super node cluster moves from pilot to large-scale deployment, the high-speed connector market will usher in an incremental space of billions.
More importantly, the investment in ByteDance is just a microcosm of the AI arms race of China’s Internet giants. Tencent and Alibaba are also significantly raising their AI capital expenditure expectations. Bernstein predicts that by 2028, the compound annual growth rate of China’s CSP and operator AI related capital expenditures will reach 25%, and the scale will reach 172 billion US dollars. In this grand narrative, the spring top needle CNC precision machining technology, as an “invisible infrastructure” for high-speed interconnection of AI servers, will continue to benefit from the expansion of the computing power industry.
3、 Dialectical Analysis: Opportunities, Challenges, and Industrial Changes
（1） Opportunity: Byte AI infrastructure opens up triple increment for precision connectors
The first increment comes from the structural upgrade of the high-speed interconnection solution for AI servers. With AI accelerating chip power consumption surpassing kilowatts, GPU servers requiring nearly 10000 pins to communicate at a rate of 224Gbps, and interconnection spacing compressed to sub millimeter level, traditional stamped spring connectors are reaching their physical limits. Micro Pogo Pin, with its residue free structure, excellent impedance continuity, and high-density wiring capability, is becoming a “forced switching” solution for XPU sockets, high-speed backplanes, and other scenarios. The intergenerational replacement of this technological route has opened up unprecedented incremental space for the spring top needle CNC precision machining industry.
The second increment comes from the large-scale deployment of byte supernode clusters. ByteDance’s supernodes are expected to experience massive growth from the second half of 2026 to 2027. As the core link of super nodes, high-speed line modules have the characteristics of “high barriers, high value, and high profit margins”. Huafeng Technology, Shenglan Co., Ltd. and other connector manufacturers are regarded by institutions as the “best elastic varieties of domestic super node connectors”. With the increasing volume of supernodes such as Ascend, Alibaba, ByteDance, and Dawn, the demand for high-speed connectors will continue to rise.
The third increment comes from the local substitution opportunities brought by the localization of Byte’s supply chain. ByteDance plans to allocate a larger proportion of the budget to domestic AI chips. In the field of connectors, domestic enterprises such as Huafeng Technology, Jinxinnuo, and Dianlian Technology have entered the Byte supply chain or are promoting project cooperation. Domestic Pogo Pin manufacturers have the complete industry chain capability from CNC precision turning, surface electroplating to automated assembly. The byte localization procurement strategy provides a historic window for domestic precision connector enterprises to enter the top Internet computing supply chain.
（2） Challenge: Technical barriers, customer concentration, and substitution competition
In terms of technical barriers, the high-speed interconnection of AI servers requires much higher requirements for connectors than consumer electronics -224Gbps PAM4 transmission rate, 0.35mm ultra small spacing, 90GHz high-frequency reserve – these indicators put forward extremely high requirements for the accuracy, material selection, and signal integrity design of CNC precision machining. Although domestic enterprises have benchmarked against international standards in key technologies such as ultra high speed signal integrity and micro/nano manufacturing, they still face continuous pressure to catch up in high-end application scenarios.
In terms of customer concentration, entering the ByteDance supply chain means a huge order volume and brand endorsement, but also implies a higher risk of customer concentration. Order fluctuations may have a significant impact on the performance of a single supplier. How to expand a diversified customer structure while serving top customers such as ByteDance is a strategic issue faced by domestic connector companies.
In terms of alternative competition, in the field of high-speed interconnection of AI servers, Micro Pogo has significant technological advantages, but still faces competition from other high-speed connection solutions. At the same time, the speed of technological iteration is extremely fast – if PCIe 6.0 promotion is slower than expected, or if a new generation of interconnect standards emerges, it may have an impact on the existing product cycle. In addition, some head connector manufacturers are actively laying out products with higher transmission rates (448G or even higher), and the pace of technology competition is accelerating.
（3） Competitive Landscape: The “Byte Window” of Domestic Replacement
The global AI server connector market is currently in a critical period of pattern reshaping. Traditional overseas giants have long occupied a dominant position in the field of high-speed connectors, but domestic enterprises are accelerating their pursuit with the help of the local Internet giant AI Infrastructure. Huafeng Technology’s high-speed backplane connectors and high-speed line module products have been widely used in fields such as AI computing power servers, super node computing power clusters, switches, supercomputers, etc. The related products will gradually be delivered in bulk from the fourth quarter of 2026 to 2027.
The domestic substitution space is huge, but the road ahead is long and arduous. In the field of consumer electronics Pogo Pin, domestic enterprises have strong competitiveness; But in the high-end arena of high-speed interconnection of AI servers, the technological barriers are higher and the verification cycle is longer. The localization procurement strategies of Internet giants such as ByteDance provide valuable “training ground” and “verification ground” for domestic enterprises. Whoever can complete large-scale production and delivery in ByteDance’s supernode cluster first is expected to establish a leading position in this wave of AI computing infrastructure.
4、 Outlook: Micro connectivity drives intelligent computing power
（1） Technological trend: higher speed, denser, and more reliable
Looking ahead to the future, the evolution of CNC precision machining technology for spring top pins in the field of AI computing power will deepen along three main lines.
In terms of higher speed, the current 224Gbps PAM4 has become the mainstream AI chip interconnect speed, and there are already product reserves in the 90GHz frequency band. Subsequent technologies can support evolution to 448G or even higher. With the continuous expansion of AI model parameter scale, the demand for inter chip interconnection bandwidth will be endless.
In terms of density, the pin density of XPU Socket continues to increase, and there is still room for further compression of Micro Pogo’s 0.35mm spacing. CNC machining requires maintaining structural integrity and electrical performance consistency at smaller sizes.
In terms of reliability, the 24/7 uninterrupted operation of AI servers places extremely high demands on the lifespan and reliability of connectors. The cylindrical independent contact design of Micro Pogo has natural advantages in vibration resistance and thermal bending resistance, but continuous breakthroughs in materials science and coating technology are still key.
（2） Industry Pattern: From “Byte Standard” to “Industry Benchmark”
ByteDance 200 billion AI infrastructure investment is not only the capital expenditure of an enterprise, but also the vane of the AI computing power competition in China’s Internet industry. Byte’s selection criteria for high-speed interconnect solutions and technical requirements for suppliers are becoming the de facto reference frame for the entire industry.
Domestic connector companies such as Huafeng Technology, Jinxinnuo, and Dianlian Technology have deeply embedded themselves in ByteDance’s supply chain system. As byte supernode clusters move from pilot to large-scale deployment, these enterprises are expected to achieve a leap from “sample matching” to “batch landing”. The domestic precision connector industry is accelerating its migration from consumer electronics supporting to the higher value-added track of AI computing infrastructure.
Post time: Sep-04-2026